生產與檢測設備最佳解決方案

IC Industry - Wafer Inspection SERIES 暗崩檢測系列

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WR1000
Type: WR1000
Wafer Size: 8~ 12 inch wafer
Functions: Backside crack and Side way crack
Equipment Functions: ♦ Machine inspection FOV 1.6x1.2mm (one pixel 2.5μm)
♦ Production range 8 inch wafer to 12 inch wafer. (conversion kit)
♦ 2D bar code read and inspection data Mapping out.
♦ Use for IR lighting and 10X microscope
♦ Off line vision re-check soft ware function
WI1110
Type: WI1110/WI2000
Wafer type & carries: wafer carrier:FFC/Hoopring ring
Wafer size:2~6 inch
Prescan capablities Resolution(μ/pixel):2.43(1.42x)
Photoluminescence:400μm
Inspection capabilities Resolution(μ/pixel):1.57(2.0x), 1.26(2.5x), 0.32(10.0x), 0.16(20.0x), 0.06(50.0x)
Defect types ♦ Surface defects, eg foreign material, passivation defects
♦ Contamination defects, eg liquid residues, surface particles
♦ Dicing defects, eg chipping
♦ Probe mark defects
Speed WPH:72(2"), 30(4"), 10(6")
System configuration
Prescan system:

♦ 500 million Gray Industrial Camera
♦ Zoom Lens
♦ Ultraviolet Lighting

Inspection system:

♦ 1200 million Color Industrial Camera
♦ Microscope with objectives on revolving turrent (5 mounts)
♦ Illumination:backlight: spot light
♦    brightfield & darkfield: LED light source (2 million Ix)
♦ Intel Pentium PC, runing MS Windows 7 Professional (64bit)