生產與檢測設備最佳解決方案

IC Industry - LID ATTACH SERIES 點膠植片系列

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DS3070
Type: DS3070
Package Size: 11x11~ 110x110mm
Package Type: FCBGA
Functions: Flip chip dispenser and lid attach
Equipment Functions: ♦ Machine 1 track, 2 dispenser heads ( auger pump ) , 6 PNP heads 4 heat clamping
♦ Auger pump accuracy 3mg±5%, dispenser accuracy ±80μm.
♦ Lid attach X,Y accuracy ± 80μm.
♦ 2Kx2K CCD epoxy quality and orientation check
♦ Laser sensor detect substrate high. Accuracy ± 100μm.
♦ PNP head force 1000g~ 3000g ±10%
♦ Un-loader 2Kx2K CCD check lid attach offset.
♦ Clamping temperature Max.200℃
♦ Carry boat size Max. 160x320mm
DS3050
Type: DS3050
Package Size: 11x11~ 55x55mm
Package Type: FCBGA
Functions: Flip chip dispenser and lid attach
Equipment Functions: ♦ Machine two track, two dispenser heads ( auger pump ) , two PNP heads two heat clamping
♦ Auger pump accuracy 3mg±5%., dispenser accuracy ±100μm.
♦ Lid attach X,Y accuracy ±100μm.
♦ 2Kx2K CCD epoxy quality and orientation check
♦ Laser sensor detect substrate high. Accuracy ±100μm.
♦ PNP head force 500g~ 3000g ±10%
♦ Un-loader 2Kx2K CCD check lid attach offset.
♦ Clamping temperature Max.200℃
♦ Carry boat size Max. 160x320mm
DS7000
Type: DS7000
Package Size: 5x5~ 50x50mm
Package Type: PBGA / matrix BGA
Functions: PBGA dispenser and heat slug attach
Equipment Functions: ♦ Machine 2 track, 1 dispenser heads (Air pump) , 3 P&P heads
♦ Air pump accuracy 10mg±10%.,
♦ Min dispensing diameter for single dot 0.8 ±0.1mm (Based on filler size 20μm)
♦ 2Kx2K CCD epoxy quality and orientation check
♦ Substrate L(150~280mm) ; W(30~100mm)
♦ The track width range 32~162mm
♦ P&P module can auto-correct the X, Y direction and rotation angle for 5 degree
♦ Dispenser and heat slug mount accuracy ±75μm.
♦ Machine X,Y axis accuracy ±25um