生產與檢測設備最佳解決方案

IC Industry - DISPENSE/SOLDER PRINT SERIES 點膠錫印系列

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SP1100
Type: SP1100
Package Size: 11x11~ 60x60mm
Package Type: FCBGA/FCCSP
Functions: Flip chip component solder print
Equipment Functions: ♦ The print mask use CCD vision auto precision adjust.
♦ Print heads unit is two head design , print accuracy ±20μm
♦ Print head can regulate the pressure for different package.
♦ Machine X, Y axis accuracy ±12.5μm.
♦ Machine can use for 0201 / 0402/ 01005 type component
♦ Machine print cycle time 26 second.
♦ Machine carry boat Max. 160x320mm.
♦ Strip type substrate Max. 95x280mm
♦ Auto mask cleaning function have three type cleaning function
SP1200
Type: SP1200
Package Size: 11x11~ 60x60mm
Package Type: FCBGA/FCCSP
Functions: Flip chip component solder print
Equipment Functions: ♦ The print mask use CCD vision auto precision adjust.
♦ Print heads unit are two head design , print accuracy ±20μm
♦ Print head can regulate the pressure for different package.
♦ Machine X, Y axis accuracy ±12.5μm.
♦ Machine can use for 0201 / 0402/ 01005 type component
♦ Machine print cycle time 26 second. One time can print 2~3 substrate.
♦ Machine carry boat Max. 230x320mm
♦ Strip type substrate Max. 95x280mm
♦ Auto mask cleaning function have three type cleaning function
SP3000
Type: SP3000
Package Size: Carry boat size 230x320mm
Package Type: FCCSP
Functions: Flip chip component solder print
Equipment Functions: ♦ The print mask use CCD vision auto precision adjust.
♦ Print heads unit are two head design , print accuracy ±12.5μm
♦ Print head can regulate the pressure for different package.
♦ Machine X, Y axis accuracy ±10μm.
♦ Machine can print for 0201 / 0402/ 01005 type component
♦ Machine print cycle time 50 second. Can print 4 substrate at once.
♦ Machine carry boat Max. 230x320mm
♦ Strip type substrate Max. 95x280mm
♦ Auto mask cleaning function have three type cleaning function