生產與檢測設備最佳解決方案

IC Industry - VISION SERIES 視覺檢測系列

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FI7300
Type: FI7300 Final Inspection For QFN, Flip chip, BGA, CSP, 5S
Package Size: 3x3mm~17x17mm
Package Type: Flip chip, BGA, CSP, QFN
Functions: Use JEDEC Standard Tray
Equipment functions: ♦ Loader can input 20 pcs tray for JEDEC or EIAJ
♦ Machine have good unit area, 5S reject area and 2D reject area
♦ Machine have 16 pick and place heads
♦ Machine have one set 5S monochrome CCD 2Kx2K
♦ Standard 2D is 2Kx2K monochrome CCD
Vision inspection: ♦ FCBGA, BGA 2D solder ball inspection
♦ FCBGA, BGA substrate inspection
♦ QFN outline, pad, and burr inspection
♦ Marking inspection
♦ BGA, QFN 5S inspection
♦ Machine have one set 5S monochrome CCD 2Kx2K
♦ Standard 2D is 2Kx2K monochrome CCD.
Option: Color CCD for 5S inspection module
FI7210
Type: FI7210 Final Inspection
Package Size: 3x3mm~47x47mm
Package Type: Flip chip, BGA, CSP, POP, QFP, TQFP, TSOP,QFN
Functions: Use JEDEC Standard Tray.
Equipment functions: ♦ Loader can input 20 pcs tray for JEDEC or EIAJ
♦ Machine have good unit area, 3D reject area and 2D reject area
♦ Machine have 16x2 array 32 pick and place heads
♦ Machine have one set 3D CCD 2Kx2K
♦ Standard 2D is 2Kx2K single color CCD. Can option 3 color CCD for AOI Function.
Vision inspection: ♦ Package 3D Function: Warpage, coplanarity, solder ball
♦ FCBGA, BGA solder ball inspection
♦ QFP, TSOP, TQFP lead, back side mark, lead pitch, compound, burr inspenction
♦ FCBGA, BGA substrate inspection
♦ QFN outline, pad, and burr inspection
♦ Machine have one set 5S monochrome CCD 2Kx2K
♦ Marking inspection
Option: Color CCD for FCBGA component AOI inspection
QFN 5S inspection
CI2100S
Type: CI2100S Flip Chip Component 2D Inspection System
Package Size: 11x11~45x45mm
Package Type: FCBGA
Functions: Component inspection:Offset , missing, solder ball, tombstone, solder bridge component rotation.
Equipment functions: ♦ Load and unloading unit can put 2 sets magazines
♦ Machine has buffer area and rejects area
♦ Use the 2kx2k RBG color CCD can inspection 0201 component
♦ Can option 4kx4k RGB color CCD for 01005 component inspection
Component inspection functions: ♦ Component offset ♦ Tombstone
♦ Wrong direction ♦ Component lift
♦ Solder bridge ♦ Missing component
♦ Solder splash ♦  Under fill inspection function: Die defect/Under fill defect
UPH: Package 31x31mm use 3x8 array board 2.8K/td>
Load capacity: Two magazines
LC6150
Type: LC6150Lane Changer(Marking Inspection)
Package Size: 3x3~17x17mm (160x320mm carry boat)
Package Type: FCBGA / FCCSP
Functions: Die offset, marking inspection
Equipment functions: ♦ FCBGA / FCCSP die bonding offset inspection
♦ Use 2Kx2K CCD one pixel 11µm
♦ In line die bonder machine and reflow machine
♦ UPH for strip type 7x7mm package size 10K
♦ Including marking inspection function
Option: SECS/GEM function
SV1000
Type: SV1000
Package Size: 3x3mm~17x17mm
Package Type: Flip chip, BGA, CSP, QFN
Functions: Use JEDEC Standard Tray.
Equipment inspection: ♦ Loader can input 20 pcs tray for JEDEC or EIAJ
♦ Machine have one pick and place heads
♦ Machine have one set 5S monochrome CCD 2Kx2K
♦ Machine no sorting function , inspection data by Map