DS3200｜Advanced Indium Processing & Heatsink Solution Machine


Product Size
  1. Package Size：
    FCBGA 8x8~135x135mm
  2. Carry Boat Size：
    (W)137~160x(L)322mm
Product Type
  1. FCBGA / FCCSP / FCLGA
Application
  1. Flip Chip Flux Jetting and Indium Attach Machine (Equipped with Dual Flux Jetting Valve Systems)
  2. FCBGA / FCCSP Dispensing and Lid attach and Snap Cure
Machine Function
  1. Flux Jetting Accuracy 1mg±10%
  2. Flux Jetting Position accuracy: 80µm
  3. Flux Jetting Mechanical Repeatability ±20µm
  4. Flux Jetting with 20M CCD for direction detection
  5. Flux Jetting with Laser Height Measurement Function
  6. Flux Jetting Module CCD detects flux jetting quality
  7. 4-heads Indium Attach System
  8. Indium Attach Heads with Pressure Detection (1kg-10kg)
  9. Indium Attach CCD Automatic Alignment Correction with Placement Accuracy of 50µm
  10. Compatible with 2D Barcode Reading Function
  11. Equipped with an Independent AOI Station for Quality Inspection of Indium attach Alignment
  12. Optional Heatsink Feeding System: Tray, Stack, Feeder
  13. The machine is equipped with SECS/GEM System
  14. Dispenser Accuracy: 3mg±5%
  15. Dispenser position accuracy: 50µm
  16. Dispenser Mechanical Repeatability: ±20µm
  17. Dispensing with 12M CCD for direction detection
  18. Dispenser with Laser Height Measurement Function
  19. Dispenser with 2 dispensing value systems
  20. Lid attach with pressure detection（1kg-10kg）
  21. Lid attach module CCD detects dispensing quality
  22. Lid attach with CCD automatic alignment accuracy: 50µm
  23. Optional Heatsink Feeding System: Tray, Stack, Feeder
  24. Compatible with 2D Barcode Reading Function
  25. Snap Cure laminating temperature: Max 200°C
  26. CCD Vision Inspection for Heatsink offset
  27. The machine is equipped with SECS/GEM System
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