DS3210|Advanced Flux Jetting Indium Attach Machine

 
Product Size
  1. Package Size:
    FCBGA 8×8~135×135mm
  2. Carry Boat Size:
    (W)137~160×(L)322mm
Product Type
  1. FCBGA / FCCSP / FCLGA
Application
  1. Flip Chip Flux Jetting and Indium Attach Machine
    (Equipped with Dual Flux Jetting Valve Systems)
Machine Function
  1. Flux Jetting Accuracy: 1mg±10%
  2. Flux Jetting Position accuracy: 80µm
  3. Flux Jetting Mechanical Repeatability±20µm
  4. Flux Jetting with 20M CCD for direction detection
  5. Flux Jetting with Laser Height Measurement Function
  6. Flux Jetting module CCD detects flux jetting quality
  7. 4-heads Indium Attach System
  8. Indium Attach Heads with Pressure Detection (1kg~10kg)
  9. Indium Attach CCD Automatic Alignment Correction with Placement Accuracy of 50µm
  10. Compatible with 2D Barcode Reading Function
  11. Equipped with an Independent AOI Station for Quality Inspection of Indium attach Alignment
  12. Optional Heatsink Feeding System: Tray, Stack, Feeder
  13. The machine is equipped with SECS/GEM System