LC6300｜Flip Chip Die Bond Offset Inspection Machine


Package Size
  1. Package Size：7x7~110x110mm
  2. Carry Boat ：137x322mm ~ 160x320mm
Product Type
  1. FCBGA / FCCSP
Application
  1. After Flip Chip Die Bonding
Machine Function
  1. CCD 25M detection system
  2. 2 models with resolutions of 5µm and 12.5µm
  3. Resloution : 12.5 µm with FOV 60x60 mm
  4. Resloution : 5 µm with FOV 25x25 mm
  5. Die Bond Offset detection accuracy: ±5µm
  6. Die Crack detection accuracy: 14µm
  7. Die Chipping detection: 45µm
  8. With component presence, absence and offset detection function
  9. With marking detection function
  10. With 2D Barcode Reading Function
  11. The machine is equipped with SECS/GEM System
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