OS7300｜PBGA Open Short Tester (After Wire Bond)


Package Size
  1. Package Size：
    PBGA 17x17~40x40mm
Product Size
  1. PBGA
Application
  1. After Wire Bonding open short tester
Machine Function
  1. Using Smart Open Short to test system, Standard I/O 1024 Pin
  2. The height of the test machine  can be expanded to 2048 Pin
  3. Test speed per Pin 2ms
  4. Single-channel dual-zone test, channel width Max. 70mm
  5. Minimum test solder ball Pitch 0.8mm
  6. With defective product re-test function
  7. Defective products are marked in the form of a Map
  8. Max. UPH 1.2K
  9. Use Load Board to test
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