LED Industry - Wafer Breaking SERIES (LED 劈裂系列)

LED 劈裂系列(Wafer Breaking SERIES)

相關機型(Models):WB1120、WB1200、WB2000、WB2120....

相關機種(Models)

  • Type: WB1120
    wafer Size: 2 inch~4inch(use 6 inch wafer frame)
    Chip Size: 7x7~ 60x60 mil
    wafer thickness: 90~ 150μm
    cutting way: Min. 25μm
    Equipment Functions: ♦ Auto wafer cassette input (One cassette 25pcs wafer)
    ♦ Broken wafer auto breaking function.
    ♦ Auto CCD system adjuest wafer orientation accuracy ±10μm
    ♦ CCD system auto adjuest cutting way
    ♦ Machine accuracy X axis 5μm, Y axis 2.5μm, Z axis 2μm
    ♦ Auto setting for re-breaking function for when wafer is not break
    ♦ Machine first yield over 96%
  • Type: WB1200
    wafer Size: 2 inch~4inch(Use 6 inch wafer frame)
    Chip Size: 7x7~ 60x60 mil
    wafer thickness: 90~ 150μm
    cutting way: Min. 25μm
    Equipment Functions: ♦ Auto wafer cassette input (One cassette 25pcs wafer)
    ♦ Broken wafer auto breaking function.
    ♦ Auto CCD system adjuest wafer orientation accuracy ±10μm
    ♦ CCD system auto adjuest cutting way
    ♦ Machine accuracy X axis 5μm, Y axis 2.5μm, Z axis 2μm
    ♦ Auto setting for re-breaking function for when wafer is not break
  • Type: WB2000
    wafer Size: 2 inch~6inch(use 6/8 inch wafer frame)
    Chip Size: 7x7~ 60x60 mil
    wafer thickness: 90~ 150μm
    cutting way: Min. 25μm
    Equipment Functions: ♦ Auto wafer cassette input (One cassette 25pcs wafer)
    ♦ Broken wafer auto breaking function.
    ♦ Auto CCD system adjuest wafer orientation accuracy ±10μm
    ♦ CCD system auto adjuest cutting way
    ♦ Machine accuracy X axis 5μm, Y axis 2.5μm, Z axis 2μm
    ♦ Auto setting for re-breaking function for when wafer is not break
  • Type: WB2120
    wafer Size: 2 inch~6inch(use 6/8 inch wafer frame)
    Chip Size: 7x7~ 60x60 mil
    wafer thickness: 90~ 150μm
    cutting way: Min. 25μm
    Equipment Functions: ♦ Auto wafer cassette input (One cassette 25pcs wafer)
    ♦ Broken wafer auto breaking function.
    ♦ Auto CCD system adjuest wafer orientation accuracy ±10μm
    ♦ CCD system auto adjuest cutting way
    ♦ Machine accuracy X axis 5μm, Y axis 2.5μm, Z axis 2μm
    ♦ Auto setting for re-breaking function for when wafer is not break

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