IC Industry - LID ATTACH SERIES 點膠植片系列

點膠植片系列(LID ATTACH SERIES)

相關機型(Models):DS3050、DS3070、DS7000....

相關機種(Models)

  • Type: DS3050
    Package Size: 11x11~ 55x55mm
    Package Type: FCBGA
    Functions: Flip chip dispenser and lid attach
    Equipment Functions: ♦ Machine two track, two dispenser heads ( auger pump ) , two PNP heads two heat clamping
    ♦ Auger pump accuracy 3mg±5%., dispenser accuracy ±100μm.
    ♦ Lid attach X,Y accuracy ±100μm.
    ♦ 2Kx2K CCD epoxy quality and orientation check
    ♦ Laser sensor detect substrate high. Accuracy ±100μm.
    ♦ PNP head force 500g~ 3000g ±10%
    ♦ Un-loader 2Kx2K CCD check lid attach offset.
    ♦ Clamping temperature Max.200℃
    ♦ Carry boat size Max. 160x320mm
  • Type: DS3070
    Package Size: 11x11~ 110x110mm
    Package Type: FCBGA
    Functions: Flip chip dispenser and lid attach
    Equipment Functions: ♦ Machine 1 track, 2 dispenser heads ( auger pump ) , 6 PNP heads 4 heat clamping
    ♦ Auger pump accuracy 3mg±5%, dispenser accuracy ±80μm.
    ♦ Lid attach X,Y accuracy ± 80μm.
    ♦ 2Kx2K CCD epoxy quality and orientation check
    ♦ Laser sensor detect substrate high. Accuracy ± 100μm.
    ♦ PNP head force 1000g~ 3000g ±10%
    ♦ Un-loader 2Kx2K CCD check lid attach offset.
    ♦ Clamping temperature Max.200℃
    ♦ Carry boat size Max. 160x320mm
  • Type: DS7000
    Package Size: 5x5~ 50x50mm
    Package Type: PBGA / matrix BGA
    Functions: PBGA dispenser and heat slug attach
    Equipment Functions: ♦ Machine 2 track, 1 dispenser heads (Air pump) , 3 P&P heads
    ♦ Air pump accuracy 10mg±10%.,
    ♦ Min dispensing diameter for single dot 0.8 ±0.1mm (Based on filler size 20μm)
    ♦ 2Kx2K CCD epoxy quality and orientation check
    ♦ Substrate L(150~280mm) ; W(30~100mm)
    ♦ The track width range 32~162mm
    ♦ P&P module can auto-correct the X, Y direction and rotation angle for 5 degree
    ♦ Dispenser and heat slug mount accuracy ±75μm.
    ♦ Machine X,Y axis accuracy ±25um

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