IC Industry - VISION SERIES 視覺檢測系列

視覺檢測系列 (VISION SERIES)

相關機型(Models):FI7300、FI7210、CI2100S、LC6150、SV1000....

相關機種(Models)

  • Type: FI7300 Final Inspection For QFN, Flip chip, BGA, CSP, 5S
    Package Size: 3x3mm~17x17mm
    Package Type: Flip chip, BGA, CSP, QFN
    Functions: Use JEDEC Standard Tray
    Equipment functions: ♦ Loader can input 20 pcs tray for JEDEC or EIAJ
    ♦ Machine have good unit area, 5S reject area and 2D reject area
    ♦ Machine have 16 pick and place heads
    ♦ Machine have one set 5S monochrome CCD 2Kx2K
    ♦ Standard 2D is 2Kx2K monochrome CCD
    Vision inspection: ♦ FCBGA, BGA 2D solder ball inspection
    ♦ FCBGA, BGA substrate inspection
    ♦ QFN outline, pad, and burr inspection
    ♦ Marking inspection
    ♦ BGA, QFN 5S inspection
    ♦ Machine have one set 5S monochrome CCD 2Kx2K
    ♦ Standard 2D is 2Kx2K monochrome CCD.
    Option: Color CCD for 5S inspection module
  • Type: FI7210 Final Inspection
    Package Size: 3x3mm~47x47mm
    Package Type: Flip chip, BGA, CSP, POP, QFP, TQFP, TSOP,QFN
    Functions: Use JEDEC Standard Tray.
    Equipment functions: ♦ Loader can input 20 pcs tray for JEDEC or EIAJ
    ♦ Machine have good unit area, 3D reject area and 2D reject area
    ♦ Machine have 16x2 array 32 pick and place heads
    ♦ Machine have one set 3D CCD 2Kx2K
    ♦ Standard 2D is 2Kx2K single color CCD. Can option 3 color CCD for AOI Function.
    Vision inspection: ♦ Package 3D Function: Warpage, coplanarity, solder ball
    ♦ FCBGA, BGA solder ball inspection
    ♦ QFP, TSOP, TQFP lead, back side mark, lead pitch, compound, burr inspenction
    ♦ FCBGA, BGA substrate inspection
    ♦ QFN outline, pad, and burr inspection
    ♦ Machine have one set 5S monochrome CCD 2Kx2K
    ♦ Marking inspection
    Option: Color CCD for FCBGA component AOI inspection
    QFN 5S inspection
  • Type: CI2100S Flip Chip Component 2D Inspection System
    Package Size: 11x11~45x45mm
    Package Type: FCBGA
    Functions: Component inspection:Offset , missing, solder ball, tombstone, solder bridge component rotation.
    Equipment functions: ♦ Load and unloading unit can put 2 sets magazines
    ♦ Machine has buffer area and rejects area
    ♦ Use the 2kx2k RBG color CCD can inspection 0201 component
    ♦ Can option 4kx4k RGB color CCD for 01005 component inspection
    Component inspection functions: ♦ Component offset ♦ Tombstone
    ♦ Wrong direction ♦ Component lift
    ♦ Solder bridge ♦ Missing component
    ♦ Solder splash ♦  Under fill inspection function: Die defect/Under fill defect
    UPH: Package 31x31mm use 3x8 array board 2.8K/td>
    Load capacity: Two magazines
  • Type: LC6150 Lane Changer(Marking Inspection)
    Package Size: 3x3~17x17mm (160x320mm carry boat)
    Package Type: FCBGA / FCCSP
    Functions: Die offset, marking inspection
    Equipment functions: ♦ FCBGA / FCCSP die bonding offset inspection
    ♦ Use 2Kx2K CCD one pixel 11µm
    ♦ In line die bonder machine and reflow machine
    ♦ UPH for strip type 7x7mm package size 10K
    ♦ Including marking inspection function
    Option: SECS/GEM function
  • Type: SV1000
    Package Size: 3x3mm~17x17mm
    Package Type: Flip chip, BGA, CSP, QFN
    Functions: Use JEDEC Standard Tray.
    Equipment inspection: ♦ Loader can input 20 pcs tray for JEDEC or EIAJ
    ♦ Machine have one pick and place heads
    ♦ Machine have one set 5S monochrome CCD 2Kx2K
    ♦ Machine no sorting function , inspection data by Map

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