IC Industry - O/S TESTING SERIES 電性測試系列

電性測試系列(O/S TESTING SERIES)

相關機型(Models):OS7300、OS7230、OS7700、OS1210....

相關機種(Models)

  • Type: OS7300
    Application: Testing of BGA products for open and short after wire-bonding.
    Testable packages: BGA series packages.
    Testable package size: 23*23mm~ 42.5*42.5mm
    I/O Pins Open/Short: ♦ Force current:0.1 mA ~ 1mA
    ♦ Open criteria:0.9~3.0V / Short criteria : 0.02~0.3V
    Power/Ground short: ♦ Force Current:0.1 mA ~10 mA
    ♦ Short Criteria:5Ω~(I/O Open Criteria)/(Force Current)
    Clamping Voltage: (I/O open criteria) +0.5V above
    Test time: N(I/O) 1ms (The fastest)
    Test pin: 128 ~ 2432 pins(One pin box) / 2560 ~ 4096 pins(Two pin box)
    Test system: Test factory-level Load Board are used with error rate as low as 1000ppm
    Equipment inspection: ♦ The push rod protection mechanism prevents the push rod from damaging packages
    ♦ Magazine-type load carrying prevents wires from being damaged, caved-in and short-circuited
    ♦ Double-instruments design, stable substrates without warping, high production of packages, low machine stand-by rate
    ♦ A probe for automatic analysis checks for damage
    ♦ Can set the number of re-checks from inspections
    ♦ A memory function of rejects from inspections can record up to 20 batches of magazing data
    ♦ The test ball pitch can reach up to 0.8mm
    UPH: 1200 for BGA 27x27mm
  • Type: OS7700
    Testable packages: PBGA/ FBGA/ Matrix BGA / FCCSP
    Testable package size: 10*10mm~ 45*45mm
    Tester functions: >Equipment function : After wire bond open short tester
    I/O Pins Open/Short: ♦ I/O Pins Open/Short
    ♦ Open Criteria:0.9~3.0V / Short Criteria:0.02~0.3V
    Power/Ground short: ♦ Short Criteria:5Ω~(I/O Open Criteria)/(Force Current)
    Clamping Voltage: (I/O open criteria) +0.5V above
    Test time: N(I/O) 1ms (The fastest)
    Test pin: 128 ~ 2432 pins(One pin box) / 2560 ~ 4096 pins(Two pin box)
    Equipment inspection: ♦ Use Smart test system Max. 2048 I/O
    ♦ Tester Min. Solder ball ptich 0.4mm, solder ball pad size 0.25mm
    ♦ Substrate thinckness 0.18mm, substrate Max. size 95x240mm
    ♦ Machine use CCD auto adjust socket and ball pad location
    ♦ No load boat design use one touch kit change over time under 20min
    UPH: 1000 for BGA 12.2x12.2mm
    Load capacity: 4 magazines
  • Type: OS7230
    Application: Testing of BGA/ TFBGA products for open short after ball mount process.
    Testable packages: BGA and TFBGA series package.
    I/O Pins Open/Short: ♦ Force current:0.1 mA ~ 1mA
    ♦ Open criteria:0.9~3.0V / Short criteria : 0.02~0.3V
    Power/Ground short: ♦ Force current:0.1 mA ~ 10mA
    ♦ Short criteria:5Ω~ (I/O Open Criteria) (Force current)
    Clamping Voltage: (I/O open criteria) +0.5V above
    Test time: N(I/O) 1ms (The fastest)
    Test pin: 128 ~ 2432 pins(One pin box) / 2560 ~ 4096 pins(Two pin box)
    Test system: Smart 1 open short test system and test erroreate as the low as 1000PPM
    Equipment inspection: ♦ Standard test I/O 1024 pins, expend Max. 2048 pins
    ♦ One touch kit design, conversion kit change only take blout 10 minutes
    ♦ Use the 300K long lift test pogo pin
    ♦ The test solder ball pitch reach up to 0.8mm
    ♦ BGA, QFN 5S inspection
    ♦ Test area pick & place area ESD under 50V
    ♦ FCBGA test clamping force control and servo motor can set up
    UPH: 800 for 31x31mm carry boat
  • Type: OS1210
    Application: Testing of BGA/ TFBGA products for open short after ball mount process.
    Testable packages: BGA and TFBGA series package.
    Testable package size: 5x5~ 40x40mm
    I/O Pins Open/Short: ♦ Force current:0.1 mA ~ 1mA
    ♦ Open criteria:0.9~3.0VShort criteria : 0.02~0.3V
    Power/Ground short: ♦ Force current:0.1 mA ~ 10mA
    ♦ Short criteria:5Ω~ (I/O open criteria) (Force Current )
    Clamping Voltage: (I/O open criteria) +0.5V above
    Test time: N(I/O) 1ms (The fastest)
    Test pin: 128 ~ 2432 pins(One pin box) / 2560 ~ 4096 pins(Two pin box)
    Test system: Test factory level load board are used with an error rate as low as 1000 PPM
    Equipment inspection: ♦ Load and unload use standard JEDEC or EIAJ tray 20 pcs
    ♦ Tester ball pas size 0.25~0.65mm. solder ball pitch 0.4~1.27mm
    ♦ Use the Smart 1 tester system
    ♦ Double suction head etch head have 5 pcs nozzle
    ♦ A probe for automatic analysis check for damage
    ♦ Can set the number of re-checks for reject, reject unit put reject tray
    ♦ User the 200K left time for pitch 1.27 and 1.0mm pogo pin
    ♦ A fast package kit replacement only takes about 20 minutes
    UPH: 3.5K for BGA 5x5mm

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